Invention Grant
- Patent Title: Semiconductor structures with a hybrid substrate
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Application No.: US17465214Application Date: 2021-09-02
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Publication No.: US12336246B2Publication Date: 2025-06-17
- Inventor: Ming-Shuan Li , Chih Chieh Yeh , Shih-Hao Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- Main IPC: H10D62/40
- IPC: H10D62/40 ; H10D30/67 ; H10D64/01 ; H10D86/40 ; H10D86/60

Abstract:
A semiconductor structure includes N-type MBC transistors formed over a first region of a hybrid substrate and P-type MBC transistors formed over a second region of the hybrid substrate. The first region and the second region have top surfaces with different crystal orientations. Particularly, the first region for forming the N-type MBC transistors includes a top surface having a (100) crystal plane and the second region for forming P-type MBC transistors includes a top surface having a (110) crystal plane.
Public/Granted literature
- US20220359647A1 Semiconductor Structures With A Hybrid Substrate Public/Granted day:2022-11-10
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