Invention Grant
- Patent Title: Semiconductor structure with metal ion capture layer
-
Application No.: US17720481Application Date: 2022-04-14
-
Publication No.: US12336256B2Publication Date: 2025-06-17
- Inventor: Yi Ting Liao , Chao-Chi Chen , Bo-Wei Chen , Shi Sheng Hu , Shun Chi Tsai
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H10D64/00
- IPC: H10D64/00 ; H01L21/28 ; H10D64/66 ; H10D84/01 ; H10D84/03 ; H10D84/85

Abstract:
The present disclosure describes a semiconductor structure with a metal ion capture layer and a method for forming the structure. The method includes forming a first fin structure and a second fin structure on a substrate and forming a first gate structure over the first fin structure and a second gate structure over the second fin structure, where the first gate structure adjoins the second gate structure. The method further includes forming a dielectric layer on the first and second gate structures, removing a portion of the dielectric layer above an adjoining portion of the first and second gate structures to form an opening, and forming a metal ion capture layer in the opening.
Public/Granted literature
- US20230335603A1 Semiconductor Structure with Metal Ion Capture Layer Public/Granted day:2023-10-19
Information query