Invention Grant
- Patent Title: Metal gate structures for field effect transistors
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Application No.: US18151575Application Date: 2023-01-09
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Publication No.: US12336265B2Publication Date: 2025-06-17
- Inventor: Chih-Wei Wang , Chia-Ming Tsai , Ke-Chih Liu , Chandrashekhar Prakash Savant , Tien-Wei Yu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H10D64/66
- IPC: H10D64/66 ; H01L21/28 ; H10D30/01 ; H10D30/62 ; H10D62/10 ; H10D84/01 ; H10D84/03 ; H10D84/83

Abstract:
The present disclosure describes a method for the formation of gate stacks having two or more titanium-aluminum (TiAl) layers with different Al concentrations (e.g., different Al/Ti ratios). For example, a gate structure can include a first TiAl layer with a first Al/Ti ratio and a second TiAl layer with a second Al/Ti ratio greater than the first Al/Ti ratio of the first TiAl layer.
Public/Granted literature
- US20230163187A1 METAL GATE STRUCTURES FOR FIELD EFFECT TRANSISTORS Public/Granted day:2023-05-25
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