Invention Grant
- Patent Title: Germanium single-crystal wafer, method for preparing germanium single-crystal wafer, method for preparing crystal bar, and use of single-crystal wafer
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Application No.: US17615484Application Date: 2020-05-15
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Publication No.: US12336319B2Publication Date: 2025-06-17
- Inventor: Rajaram Shetty , Yuanli Wang , Weiguo Liu , Yvonne Zhou , Sung-Nee George Chu
- Applicant: BEIJING TONGMEI XTAL TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING TONGMEI XTAL TECHNOLOGY CO., LTD.
- Current Assignee: BEIJING TONGMEI XTAL TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Clements Bernard Walker
- Agent Christopher L. Bernard
- Priority: CN201910483748.4 20190531
- International Application: PCT/CN2020/090402 WO 20200515
- International Announcement: WO2020/238646 WO 20201203
- Main IPC: H10F71/00
- IPC: H10F71/00 ; C30B29/06 ; C30B29/08 ; H10D62/10 ; H10F10/174

Abstract:
A germanium single-crystal wafer comprises silicon with an atomic concentration of from 3×1014 atoms/cc to 10×1018 atoms/cc, boron with an atomic concentration of from 1×1016 atoms/cc to 10×1018 atoms/cc, and gallium with an atomic concentration of from 1×1016 atoms/cc to 10×1019 atoms/cc. Further provided are a method for preparing the germanium single-crystal wafer, a method for preparing a germanium single-crystal ingot, and the use of the germanium single-crystal wafer for increasing the open-circuit voltage of a solar cell. The germanium single-crystal wafer has an improved electrical property in that it has a smaller difference in resistivity and carrier concentration.
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