Invention Grant
- Patent Title: Method of manufacturing light emitting device
-
Application No.: US18446382Application Date: 2023-08-08
-
Publication No.: US12336344B2Publication Date: 2025-06-17
- Inventor: Hirosuke Hayashi
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Global IP Counselors, LLP
- Priority: JP2018-003910 20180115
- Main IPC: H10H20/856
- IPC: H10H20/856 ; H10H20/85 ; H10H20/851 ; H10H20/01 ; H10H20/80

Abstract:
A method of manufacturing a light emitting device includes: providing a light emitting structure including a light emitting element having a top surface and lateral surfaces, a wavelength conversion member having a top surface, a bottom surface, and lateral surfaces, with the bottom surface of the wavelength conversion member facing the top surface of the light emitting element, and a reflecting member surrounding the lateral surfaces of the light emitting element and the lateral surfaces of the wavelength conversion member, the reflecting member having a top surface; and supplying a covering member to cover the top surface of the wavelength conversion member and the top surface of the reflecting member, the covering member containing at least one of a pigment and a dye so that a body color of the covering member is the same or a similar color as a body color of the wavelength conversion member.
Public/Granted literature
- US20230387361A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2023-11-30
Information query