Invention Grant
- Patent Title: Resistive memory device and preparation method thereof
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Application No.: US17807030Application Date: 2022-06-15
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Publication No.: US12336441B2Publication Date: 2025-06-17
- Inventor: Wei Chang , Jiefang Deng , Xiaoguang Wang
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN202110779767.9 20210709
- Main IPC: H10B63/00
- IPC: H10B63/00 ; H10N70/00 ; H10N70/20

Abstract:
Embodiments of the present application relate to a resistive memory device and a preparation method thereof. The preparation method includes: providing a base; forming bit line trenches in the base; forming a resistive material layer on a sidewall and the bottom of the bit line trench; and forming a bit line structure in the bit line trench through filling, wherein a variable resistor structure includes the bit line structure and the resistive material layer.
Public/Granted literature
- US20230008157A1 RESISTIVE MEMORY DEVICE AND PREPARATION METHOD THEREOF Public/Granted day:2023-01-12
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