Invention Grant
- Patent Title: Multi-layer integrated circuit routing tool
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Application No.: US17814855Application Date: 2022-07-26
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Publication No.: US12340161B2Publication Date: 2025-06-24
- Inventor: Ralf Richter , Lukas Daellenbach
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent Elliot J. Shine
- Main IPC: G06F30/394
- IPC: G06F30/394 ; G06F30/392 ; G06F111/04 ; G06F119/12

Abstract:
A computer implemented method for a multi-layer integrated circuit routing tool connecting sources with nets to sinks in a hierarchical multi-layer integrated circuit design environment, the method including creating a cycle reach table containing a first set of information parameters for two dimensional nets per metal layer combination, creating a repeater reach table containing a second set of information parameters per constraint class, preparing a working list of nets, preparing a list of blocks larger than repeater reach dimensions, connecting a source pin to a sink pin on preassigned metal layers, by routing the net based on the given constraint class.
Public/Granted literature
- US20240037311A1 MULTI-LAYER INTEGRATED CIRCUIT ROUTING TOOL Public/Granted day:2024-02-01
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