Invention Grant
- Patent Title: Apparatus and method for displaced mesh compression
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Application No.: US16819118Application Date: 2020-03-15
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Publication No.: US12340468B2Publication Date: 2025-06-24
- Inventor: Sven Woop , Karthik Vaidyanathan , Carsten Benthin
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: NICHOLSON DE VOS WEBSTER & ELLIOTT LLP
- Main IPC: G06T17/20
- IPC: G06T17/20 ; G06T3/4007 ; G06T9/00 ; G06T15/00 ; G06T15/06 ; G06T15/08 ; G06T17/10

Abstract:
Apparatus and method for lossy displaced mesh compression. For example, one embodiment of an apparatus comprises: displacement mapping circuitry/logic to generate an original displacement-mapped mesh by performing a displacement mapping of a plurality of vertices of a base subdivision mesh; and mesh compression circuitry/logic to compress the original displacement-mapped mesh, the mesh compression circuitry/logic comprising a quantizer to quantize the displacement mapping of the plurality of vertices in view of a base mesh to generate a displacement array.
Public/Granted literature
- US20210287431A1 APPARATUS AND METHOD FOR DISPLACED MESH COMPRESSION Public/Granted day:2021-09-16
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