Invention Grant
- Patent Title: Coil component, circuit board arrangement, electronic device and method of manufacturing coil component
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Application No.: US18186854Application Date: 2023-03-20
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Publication No.: US12340931B2Publication Date: 2025-06-24
- Inventor: Yasuhiro Arai , Tomoo Kashiwa
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JP2022-057139 20220330
- Main IPC: H01F27/255
- IPC: H01F27/255 ; H01F17/04 ; H01F27/29 ; H01F41/04 ; H05K1/02 ; H05K1/18

Abstract:
A coil component includes a base body, a conductor inside the base body, and an external electrode electrically connected to the conductor. The base body has metal magnetic particles bonded by a first resin, and has a first surface that faces a mounting board, and a second surface adjacent to the first surface. The external electrode includes a first conductive resin layer on the first surface, which is made of a material that contains a second resin and first metal particles. The external electrode includes a second conductive resin layer on the second surface, which is made of a material that contains a third resin and second metal particles. A content rate of the third resin is smaller than a content rate of the second resin. The external electrode includes a metal layer covering the first and second conductive resin layers.
Public/Granted literature
- US20230326655A1 COIL COMPONENT, CIRCUIT BOARD ARRANGEMENT, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING COIL COMPONENT Public/Granted day:2023-10-12
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