A wiring board includes at least one insulating layer, plurality of conductive members, at least one land electrode formed at position overlapping first surface in plan view of insulating layer as viewed from first surface side, land electrode being connected to each of at least one conductive member, and coil conductor provided inside insulating layer or on second surface on back side of first surface in insulating layer and having winding axis intersecting first surface. Plurality of conductive members includes first conductive member at position where at least part of the first conductive member overlaps opening of the coil conductor in plan view seen from first surface side, and second conductive member at position deviated from opening of coil conductor in plan view seen from first surface side. Area of first conductive member is smaller than area of second conductive member in plan view seen from first surface side.