Invention Grant
- Patent Title: Electronic component and method for manufacturing electronic component
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Application No.: US18067042Application Date: 2022-12-16
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Publication No.: US12342471B2Publication Date: 2025-06-24
- Inventor: Hirofumi Oie , Toru Yaso , Kiyohiro Kashiuchi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: McDonald Hopkins LLC
- Priority: JP2020-105360 20200618
- Main IPC: B32B3/10
- IPC: B32B3/10 ; H01L23/15 ; H05K1/05 ; H05K3/12 ; H05K3/24 ; H05K3/46

Abstract:
An electronic component of the present disclosure includes: an electronic component body; an electrode on a surface of the electronic component body; and a cover layer having insulating properties on at least a portion of a perimeter of the electrode and extending across a boundary between the perimeter of the electrode and the surface of the electronic component body, wherein in a plan view of the electronic component body seen from a side where the electrode is disposed, the electrode includes corners each provided by two segments defining a portion of the perimeter of the electrode, and a thickness of at least a portion of the cover layer on at least one of the corners is greater than a thickness of the other portions of the cover layer on portions other than the corners.
Public/Granted literature
- US20230119828A1 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT Public/Granted day:2023-04-20
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