Invention Grant
- Patent Title: Electrical panelboard assembly including power distribution heatsink assembly, systems and methods
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Application No.: US18054425Application Date: 2022-11-10
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Publication No.: US12342496B2Publication Date: 2025-06-24
- Inventor: Jayram Desai , Graig E. DeCarr , Michael Raddell
- Applicant: EATON INTELLIGENT POWER LIMITED
- Applicant Address: IE Dublin
- Assignee: EATON INTELLIGENT POWER LIMITED
- Current Assignee: EATON INTELLIGENT POWER LIMITED
- Current Assignee Address: IE Dublin
- Agency: Merchant & Gould P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01H71/02 ; H01H9/52

Abstract:
A panelboard assembly for a harsh and/or hazardous environment is provided. The panelboard assembly includes a core assembly. The core assembly includes a main breaker assembly configured to be electrically connected to a power supply, and a branch breaker assembly electrically connected to the main breaker assembly and configured to be electrically connected to one or more loads, and a power distribution heatsink assembly. The power distribution heatsink assembly includes an electrically-conductive heatsink having a first end and an opposing second end, the first end electrically connected to the core assembly and an electrically-nonconductive isolator electrically insulating the heatsink.
Public/Granted literature
- US20230146112A1 ELECTRICAL PANELBOARD ASSEMBLY INCLUDING POWER DISTRIBUTION HEATSINK ASSEMBLY, SYSTEMS AND METHODS Public/Granted day:2023-05-11
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