Invention Grant
- Patent Title: Thermal dissipation structure and drive unit
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Application No.: US18300308Application Date: 2023-04-13
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Publication No.: US12342506B2Publication Date: 2025-06-24
- Inventor: Taichi Ohno , Taichi Kitamura
- Applicant: EXEDY Corporation
- Applicant Address: JP Neyagawa
- Assignee: EXEDY Corporation
- Current Assignee: EXEDY Corporation
- Current Assignee Address: JP Neyagawa
- Agency: United IP Counselors, LLC
- Priority: JP2022-079593 20220513
- Main IPC: H05K7/20
- IPC: H05K7/20 ; B66F9/075

Abstract:
A thermal dissipation structure includes a housing, a thermal dissipation mechanism, and a seal member. The housing accommodates a heat-generating element. The thermal dissipation mechanism includes a thermal transfer part and a thermal dissipation part. The thermal transfer part is disposed inside the housing. The thermal transfer part is configured to transfer heat generated by the heat-generating element. The thermal dissipation part is disposed outside the housing. The seal member seals between the housing and the thermal dissipation mechanism.
Public/Granted literature
- US20230371207A1 THERMAL DISSIPATION STRUCTURE AND DRIVE UNIT Public/Granted day:2023-11-16
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