Invention Application
- Patent Title: Printed circuit board having inductive vias
- Patent Title (中): 具有感应通孔的印刷电路板
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Application No.: US09883876Application Date: 2001-06-18
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Publication No.: US20020022110A1Publication Date: 2002-02-21
- Inventor: Alexander W. Barr , Samuel C. Ramey , Larry Edward Moser
- Main IPC: B32B003/10
- IPC: B32B003/10
Abstract:
A printed circuit board includes at least one via providing a conductive path through the printed circuit board. The via comprises at least one axially extending conductive strip fonned by cutting material from a metal barrel lining the interior wall of the via.
Public/Granted literature
- US06711814B2 Method of making printed circuit board having inductive vias Public/Granted day:2004-03-30
Information query
