Invention Application
- Patent Title: Film-forming method, film-forming apparatus and liquid film drying apparatus
- Patent Title (中): 成膜方法,成膜装置和液膜干燥装置
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Application No.: US09961288Application Date: 2001-09-25
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Publication No.: US20020037367A1Publication Date: 2002-03-28
- Inventor: Tatsuhiko Ema , Shinichi Ito , Katsuya Okumura
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: null
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: null
- Priority: JP2000-295232 20000927; JP2000-296089 20000928
- Main IPC: B05D003/12
- IPC: B05D003/12 ; B05D003/02 ; B05D001/02

Abstract:
Disclosed is a film-forming method, comprising dispensing from a dispenser nozzle a coating solution, which is prepared by adding a solid component to a solvent and controlled to be spread on the substrate in a predetermined range, onto a target substrate to be processed while relatively moving the dispenser nozzle and the target substrate so as to form a liquid film on the entire surface of the target substrate, and arranging a sucking nozzle above and apart from the target substrate such that the sucking nozzle is not in contact with the surface of the liquid film so as to permit the sucking nozzle to suck the solvent vapor right under the sucking nozzle while moving the sucking nozzle relative to the target substrate, thereby removing the solvent from the liquid film and, thus, forming a coated film.
Public/Granted literature
- US06709699B2 Film-forming method, film-forming apparatus and liquid film drying apparatus Public/Granted day:2004-03-23
Information query