Invention Application
- Patent Title: Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
- Patent Title (中): 树脂板，树脂板的制造工艺，连接介质体，电路板和电路板的制造工艺
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Application No.: US09962245Application Date: 2001-09-26
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Publication No.: US20020037397A1Publication Date: 2002-03-28
- Inventor: Takeshi Suzuki , Satoru Tomekawa , Yoshihiro Kawakita , Yasushi Nakagiri , Fumio Echigo
- Applicant: Matsushita Electric Industrial Co. Ltd.
- Applicant Address: null
- Assignee: Matsushita Electric Industrial Co. Ltd.
- Current Assignee: Matsushita Electric Industrial Co. Ltd.
- Current Assignee Address: null
- Priority: JPP2000-294027 20000927
- Main IPC: B32B003/00
- IPC: B32B003/00
Abstract:
A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.
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