Invention Application
- Patent Title: Production of diaphragms
- Patent Title (中): 膜片生产
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Application No.: US09881744Application Date: 2001-06-18
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Publication No.: US20020045287A1Publication Date: 2002-04-18
- Inventor: Harold S. Gamble , S.J. Neil Mitchell , Andrzej Prochaska , Stephen Peter Fitzgerald
- Applicant: RANDOX LABORATORIES LIMITED
- Applicant Address: GB Crumlin
- Assignee: RANDOX LABORATORIES LIMITED
- Current Assignee: RANDOX LABORATORIES LIMITED
- Current Assignee Address: GB Crumlin
- Priority: GB0015500.2 20000623
- Main IPC: H01L021/00
- IPC: H01L021/00
Abstract:
A method of manufacturing a diaphragm utilizing a precision grinding technique after etching a cavity in a wafer. A technique for preventing distortion of the diaphragm based on use of a sacrificial layer of porous silicon is disclosed.
Public/Granted literature
- US06551851B2 Production of diaphragms over a cavity by grinding to reduce wafer thickness Public/Granted day:2003-04-22
Information query
