A circuit board and a ball grid array (BGA) package having a solder joint with improved reliability are disclosed. The circuit board has a chip mounting surface in which wiring patterns are formed and a solder ball mounting surface in which a plurality of solder balls are mounted and electrically interconnected to the wiring patterns. The circuit board comprises a plurality of ball lands connected to the solder balls. The circuit board further includes solder ball opening area defined by a solder ball mask on the solder ball mounting surface and exposing the ball land from the solder ball mask, a plurality of pattern connecting portions each connected to corresponding one of the ball lands, and conductive wiring patterns linked together with the pattern connecting portions and electrically interconnected to the solder balls. The plurality of pattern connecting portions are aligned radially inwardly toward substantially a center point of the solder ball mounting surface.