Invention Application
US20020068173A1 Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board
有权
不燃性树脂组合物，预浸料，层压板，覆金属层压板，印刷线路板和多层印刷线路板
- Patent Title: Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board
- Patent Title (中): 不燃性树脂组合物，预浸料，层压板，覆金属层压板，印刷线路板和多层印刷线路板
-
Application No.: US09973719Application Date: 2001-10-11
-
Publication No.: US20020068173A1Publication Date: 2002-06-06
- Inventor: Nozomu Takano , Tomio Fukuda , Masato Miyatake
- Applicant: HITACHI CHEMICAL CO., TLD
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL CO., TLD
- Current Assignee: HITACHI CHEMICAL CO., TLD
- Current Assignee Address: JP Tokyo
- Priority: JPP2000-313720 20001013
- Main IPC: B32B027/38
- IPC: B32B027/38 ; C08F008/00
Abstract:
An incombustible resin composition in which a silicone oligomer, a metal hydrate and a resin material are contained as essential components, the metal hydrate is 20% by weight or more in the total solids of the resin composition is provided.
Public/Granted literature
Information query
