A modified SMT (Surface Mount Technology) process is proposed for mounting an exposed-pad type of semiconductor device over a PCB (printed circuit board), which can help prevent the problem of floated soldering of the semiconductor device over the PCB. By this modified SMT process, a plurality of via holes are formed in the pad-mounting area of the printed circuit board; and a solder material is pasted over the bottom end of each of the via holes. As the semiconductor device is mounted in position over the printed circuit board, a solder-reflow process is performed on the pasted solder material so as to cause the pasted solder material to be wetted to the entire surface of the solder-wettable layer in each of the via holes, thereby allowing the solder material to reflow to the upper end of each of the via holes where the reflowed solder is also wetted to the exposed die pad of the semiconductor device, thereby securely bonding the semiconductor device to the PCB.