Method and system of tape automated bonding

Invention Application

US20030065367A1 Method and system of tape automated bonding 有权

Title translation: 胶带自动粘接的方法和系统

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Patent Title: Method and system of tape automated bonding
Patent Title (中): 胶带自动粘接的方法和系统
Application No.: US09970145

Application Date: 2001-10-02
Publication No.: US20030065367A1

Publication Date: 2003-04-03
Inventor: Nick A. Youker , Ronald L. Anderson , John E. Hansen
Main IPC: A61N001/375
IPC: A61N001/375

Method and system of tape automated bonding

Abstract:

A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.

Abstract(Chinese):

一种胶带自动接合（TAB）结构，其包括在其上形成导电图案的柔性带。导电引线图形包括多个引线，其被配置为形成TAB结构的内部引线键合（ILB）部分。所述多个引线中的至少一个在内部布线并且具有暴露在TAB结构的ILB部分内部的触点。

Public/Granted literature

US07190069B2 Method and system of tape automated bonding Public/Granted day:2007-03-13

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