Invention Application
US20030077881A1 Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support
有权
用于操作集成在晶片半导体上并且要彼此切割的MEMS器件的方法以及相关的支持
- Patent Title: Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support
- Patent Title (中): 用于操作集成在晶片半导体上并且要彼此切割的MEMS器件的方法以及相关的支持
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Application No.: US10214998Application Date: 2002-08-08
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Publication No.: US20030077881A1Publication Date: 2003-04-24
- Inventor: Ilaria Gelmi , Simone Sassolini , Stefano Pozzi , Massimo Garavaglia
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Main IPC: H01L021/301
- IPC: H01L021/301
Abstract:
A method for manipulating MEMS devices integrated on a semiconductor wafer and intended to be diced one from the other includes bonding of the semiconductor wafer including the MEMS devices on a support with interposition of a bonding sheet. The method may also include completely cutting or dicing of the semiconductor wafer into a plurality of independent MEMS devices, and processing the MEMS devices diced and bonded on the support in a treatment environment for semiconductor wafers. A support for manipulating MEMS devices is also included.
Public/Granted literature
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