Where a result of operations to mount electronic components is inspected, for example, an operating procedure of an inspecting operation is determined on the basis of mounting-condition information such as used-device information relating to used suction nozzles, feeders and other devices, and mounting-result information such as information relating to recovery actions. The operating procedure may be determined on the basis of device-usage hysteresis information as well. For instance, the inspection operation is performed on inspecting objects selected from the mounting objects, such as mounting objects mounted with nozzles of high mounting defect ratios, mounting objects mounted with feeders of long use, etc. Additional inspecting objects are selected such that each mounting object is inspected at a predetermined frequency or such that the inspection can be effected within a predetermined time. The inspecting order may be determined so as to complete the inspection in a shortest possible time.