Invention Application
- Patent Title: Indirect monitoring of semiconductor light source within a photonic package
- Patent Title (中): 光子封装内半导体光源的间接监测
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Application No.: US10087877Application Date: 2002-03-01
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Publication No.: US20030164448A1Publication Date: 2003-09-04
- Inventor: David R. Ohm , Richard A. Booman
- Main IPC: H01J005/02
- IPC: H01J005/02

Abstract:
A photonic package includes a housing having a semiconductor light source disposed within the housing. The semiconductor light source has a first output and a second output. A reflective surface is disposed inside the housing to reflect the second output from the semiconductor light source. A photodetector is also disposed within the housing and is adapted to indirectly receive the second output of the semiconductor light source reflected off the reflective surface. As a result, interior surface of a housing of an optical transponder may be utilized to provide reflected light to a photodetector to monitor the semiconductor light source.
Public/Granted literature
- US06803562B2 Indirect monitoring of semiconductor light source within a photonic package Public/Granted day:2004-10-12
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