Invention Application
US20030164448A1 Indirect monitoring of semiconductor light source within a photonic package 失效
光子封装内半导体光源的间接监测

  • Patent Title: Indirect monitoring of semiconductor light source within a photonic package
  • Patent Title (中): 光子封装内半导体光源的间接监测
  • Application No.: US10087877
    Application Date: 2002-03-01
  • Publication No.: US20030164448A1
    Publication Date: 2003-09-04
  • Inventor: David R. OhmRichard A. Booman
  • Main IPC: H01J005/02
  • IPC: H01J005/02
Indirect monitoring of semiconductor light source within a photonic package
Abstract:
A photonic package includes a housing having a semiconductor light source disposed within the housing. The semiconductor light source has a first output and a second output. A reflective surface is disposed inside the housing to reflect the second output from the semiconductor light source. A photodetector is also disposed within the housing and is adapted to indirectly receive the second output of the semiconductor light source reflected off the reflective surface. As a result, interior surface of a housing of an optical transponder may be utilized to provide reflected light to a photodetector to monitor the semiconductor light source.
Information query
Patent Agency Ranking
0/0