Invention Application
- Patent Title: Solid image pickup apparatus
- Patent Title (中): 固体摄像装置
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Application No.: US10210077Application Date: 2002-08-02
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Publication No.: US20030173634A1Publication Date: 2003-09-18
- Inventor: Kohji Shinomiya
- Applicant: Mitsubishi Denki Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Priority: JP2002-070334 20020314
- Main IPC: H01L031/0232
- IPC: H01L031/0232
Abstract:
A solid image pickup apparatus comprises a flexible printed circuit board. A solid image pickup element and an optical lens held in a casing are disposed on the flexible printed circuit board. The flexible printed circuit board has a surface on which a capacitor is formed.
Public/Granted literature
- US06727564B2 Solid image pickup apparatus Public/Granted day:2004-04-27
Information query
