Invention Application
- Patent Title: Electromagnetic bus coupling
- Patent Title (中): 电磁总线耦合
-
Application No.: US10183614Application Date: 2002-06-25
-
Publication No.: US20030236005A1Publication Date: 2003-12-25
- Inventor: Yinan Wu , Tao Liang , John R. Benham
- Main IPC: H05K001/00
- IPC: H05K001/00 ; H01R012/00

Abstract:
An assembly (for example, an assembly in the form of an interposer that is distinct from a motherboard and from the devices that communicate with the motherboard) includes electromagnetic couplings. Each of the electromagnetic couplings couples signals being communicated between a device and a bus. Each of the electromagnetic couplings is connected to (a) an associated bus connector to provide connections of the couplings to the bus, and (b) an associated device connector to provide connections of the couplings to the device.
Public/Granted literature
- US07068120B2 Electromagnetic bus coupling having an electromagnetic coupling interposer Public/Granted day:2006-06-27
Information query