Invention Application
- Patent Title: Via shielding for power/ground layers on printed circuit board
- Patent Title (中): 通过屏蔽印刷电路板上的电源/接地层
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Application No.: US10888064Application Date: 2004-07-08
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Publication No.: US20040238216A1Publication Date: 2004-12-02
- Inventor: Rebecca A. Jessep , Terrance J. Dishongh , Carolyn R. McCormick , Thomas O. Morgan
- Main IPC: H05K001/03
- IPC: H05K001/03 ; H05K001/11

Abstract:
A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the conductive layer and create a short circuit. In one embodiment, the protective coating is sufficiently hard to deflect a drill bit being used to drill the via hole, thus protecting against misregistered drilled holes.
Public/Granted literature
- US07271349B2 Via shielding for power/ground layers on printed circuit board Public/Granted day:2007-09-18
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