Invention Application
US20040238216A1 Via shielding for power/ground layers on printed circuit board 有权
通过屏蔽印刷电路板上的电源/接地层

Via shielding for power/ground layers on printed circuit board
Abstract:
A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive material in a via within the clearance hole will not contact the conductive layer and create a short circuit. In one embodiment, the protective coating is sufficiently hard to deflect a drill bit being used to drill the via hole, thus protecting against misregistered drilled holes.
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