Invention Application
- Patent Title: Inkjet printhead chip with densely packed nozzles
- Patent Title (中): 喷墨打印头芯片具有密集喷嘴
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Application No.: US10853227Application Date: 2004-05-26
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Publication No.: US20040257400A1Publication Date: 2004-12-23
- Inventor: Kia Silverbrook
- Priority: AUPP6539 19981016
- Main IPC: B41J002/145
- IPC: B41J002/145

Abstract:
An inkjet printhead chip includes a substrate that incorporates drive circuitry. A plurality of nozzle arrangements is positioned on the substrate. Each nozzle arrangement includes a nozzle chamber wall and a roof wall positioned on the substrate to define a nozzle chamber, the roof wall defining an ink ejection port in fluid communication with the nozzle chamber. The nozzles are densely packed on the printhead substrate for greater resolution and print quality. The nozzles are arranged in rows with each row offset relative to its adjacent rows to reduce the effective nozzle pitch across the printhead. The printhead is high speed and energy efficient by ejecting relatively low mass drops at a high frequency.
Public/Granted literature
- US06921150B2 Inkjet printhead chip with densely packed nozzles Public/Granted day:2005-07-26
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