Invention Application
- Patent Title: Electronic member, method for making the same, and semiconductor device
- Patent Title (中): 电子元件及其制造方法以及半导体器件
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Application No.: US10502129Application Date: 2003-10-22
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Publication No.: US20050067703A1Publication Date: 2005-03-31
- Inventor: Takeshi Hashimoto
- Applicant: Takeshi Hashimoto
- Priority: JP2002-308684 20021023
- International Application: PCT/JP03/13493 WO 20031022
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L23/495 ; H01L23/538 ; H05K1/00 ; H05K3/00 ; H05K3/20 ; H05K3/22 ; H05K3/38 ; H01L23/48
Abstract:
The present invention provides an electronic device having high insulating reliability, in which metal portions of a circuit are not electrically conductive with each other via an adhesive layer even when the electronic device is used in high-temperature low-humidity conditions or high-temperature high-humidity conditions, and provides a production method for the electronic device, and a semiconductor device comprising the electronic device. In the electronic device in which a circuit formed by pattern formation of metal portions is attached via an adhesive layer to an insulating base, the adhesive layer, which contacts adjacent metal portions, is divided. Typically, the electronic device is one of a lead frame having a lead frame fixing tape, a TAB tape, and a flexible printed circuit board.
Public/Granted literature
- US07312145B2 Electronic member, method for making the same, and semiconductor device Public/Granted day:2007-12-25
Information query
IPC分类:
