Invention Application
- Patent Title: Insertion of electrical component within a via of a printed circuit board
- Patent Title (中): 在印刷电路板的通孔内插入电气部件
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Application No.: US10991064Application Date: 2004-11-17
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Publication No.: US20050087366A1Publication Date: 2005-04-28
- Inventor: Timothy Crockett , Harry Minikel
- Applicant: Timothy Crockett , Harry Minikel
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/14 ; H05K1/18 ; H05K3/40 ; H05K1/03
Abstract:
A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.
Public/Granted literature
- US07188410B2 Insertion of electrical component within a via of a printed circuit board Public/Granted day:2007-03-13
Information query
