An apparatus and method for making a compliant interconnect assembly adapted to electrically couple a first circuit member to a second circuit member. The first dielectric layer has a first major surface and a plurality of through openings. A plurality of electrical traces are positioned against the first major surface of the first dielectric layer. The electric traces include a plurality of conductive compliant members having first distal ends aligned with a plurality of the openings in the first dielectric layer. The first distal ends are adapted to electrically couple with the first circuit member. The second dielectric layer has a first major surface positioned against the electric traces and the first major surface of the first dielectric layer. The second dielectric layer has a plurality of through openings through which the electric traces electrically couple with the second circuit member.