Invention Application
- Patent Title: Forming a substrate core with embedded capacitor and structures formed thereby
-
Application No.: US11027386Application Date: 2004-12-30
-
Publication No.: US20060143886A1Publication Date: 2006-07-06
- Inventor: Sriram Srinivasan , John Guzek , Cengiz Palanduz , Victor Prokofiev , Joel Auernheimer
- Applicant: Sriram Srinivasan , John Guzek , Cengiz Palanduz , Victor Prokofiev , Joel Auernheimer
- Main IPC: H01G7/00
- IPC: H01G7/00 ; H01G4/20
Abstract:
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
Public/Granted literature
- US09572258B2 Method of forming a substrate core with embedded capacitor and structures formed thereby Public/Granted day:2017-02-14
Information query
