Invention Application
- Patent Title: Wiring board and production method of wiring board
- Patent Title (中): 接线板接线板及接线板的生产方法
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Application No.: US11580849Application Date: 2006-10-16
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Publication No.: US20070029107A1Publication Date: 2007-02-08
- Inventor: Hideo Aoki , Chiaki Takubo , Naoko Yamaguchi
- Applicant: Hideo Aoki , Chiaki Takubo , Naoko Yamaguchi
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Priority: JP2004-118350 20040413
- Main IPC: G03C3/00
- IPC: G03C3/00
Abstract:
A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.
Public/Granted literature
- US07469941B2 Method of producing a wiring board Public/Granted day:2008-12-30
Information query
