Invention Application
- Patent Title: Thermoresponsive sensor comprising a polymer solution
- Patent Title (中): 包含聚合物溶液的感温传感器
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Application No.: US11399890Application Date: 2006-04-07
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Publication No.: US20070029198A1Publication Date: 2007-02-08
- Inventor: Chee Kooi
- Applicant: Chee Kooi
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Main IPC: G03B27/52
- IPC: G03B27/52 ; C07K1/26
Abstract:
Methods and apparatus for measuring and/or controlling the temperature on the surface or inside of microchips are provided, including using thermally responsive polymers.
Public/Granted literature
- US07307141B2 Thermoresponsive sensor comprising a polymer solution Public/Granted day:2007-12-11
Information query
