Invention Application
- Patent Title: Semiconductor device having termination circuit line
- Patent Title (中): 具有终端电路线的半导体装置
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Application No.: US11335523Application Date: 2006-01-20
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Publication No.: US20070029662A1Publication Date: 2007-02-08
- Inventor: Jong-Joo Lee
- Applicant: Jong-Joo Lee
- Priority: KR2005-72386 20050808
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
A semiconductor device may have a plurality of dielectric layers and at least one termination circuit line between the dielectric layers. The termination circuit lines may be formed over the active surface of a semiconductor substrate.
Information query
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