Substrate and method for producing same

Invention Application

US20070072425A1 Substrate and method for producing same 审中-公开

Title translation: 基材及其制造方法

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Patent Title: Substrate and method for producing same
Patent Title (中): 基材及其制造方法
Application No.: US10574603

Application Date: 2004-10-06
Publication No.: US20070072425A1

Publication Date: 2007-03-29
Inventor: Fumiaki Kikui , Akio Morishita , Masato Yasuoka
Applicant: Fumiaki Kikui , Akio Morishita , Masato Yasuoka
Applicant Address: JP Osaka 564-0043
Assignee: NEOMAX MATERIALS CO., LTD.
Current Assignee: NEOMAX MATERIALS CO., LTD.
Current Assignee Address: JP Osaka 564-0043
Priority: JP2003-347904 20031007
International Application: PCT/JP04/15108 WO 20041006
Main IPC: H01L21/461
IPC: H01L21/461 ; H01L21/302 ; H01L21/4763 ; H01L29/94 ; H01L27/108 ; H01L29/76 ; H01L31/119

Abstract:

A substrate according to the present invention includes a metal plate, and an insulating film, which is provided on the surface of the metal plate and which includes needle alumina particles and granular particles. The substrate of the present invention has excellent insulating property and can be manufactured on an industrial basis with acceptable efficiency.

Abstract(Chinese):

根据本发明的基板包括金属板和绝缘膜，其设置在金属板的表面上并且包括针状氧化铝颗粒和颗粒状颗粒。本发明的基板具有优异的绝缘性能，可以在工业上以可接受的效率制造。

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/46	....用H01L21/36至H01L21/428各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/44）
H01L21/461	.....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割