Invention Application
- Patent Title: High density DSX system
- Patent Title (中): 高密度DSX系统
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Application No.: US11492707Application Date: 2006-07-25
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Publication No.: US20070081659A1Publication Date: 2007-04-12
- Inventor: Scott Baker , James Dewey , Dominic Louwagie , Harvey Chouanard
- Applicant: Scott Baker , James Dewey , Dominic Louwagie , Harvey Chouanard
- Applicant Address: US MN Eden Prairie
- Assignee: ADC Telecommunications, Inc.
- Current Assignee: ADC Telecommunications, Inc.
- Current Assignee Address: US MN Eden Prairie
- Main IPC: H04M3/00
- IPC: H04M3/00 ; H04M5/00
Abstract:
A DSX system arranged to receive a plurality of high-density chassis is disclosed. The chassis include back planes having rear access IN/OUT fields and rear access cross-connect fields. The rear access fields are electrically connected to termination panels located in respective IN/OUT regions and cross-connect regions. Each of the regions includes cable management channels within which system cables are routed.
Information query
