Invention Application
- Patent Title: Wiring board, method of manufacturing wiring board, and liquid ejection head
- Patent Title (中): 接线板，制造布线板的方法和液体喷射头
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Application No.: US11520667Application Date: 2006-09-14
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Publication No.: US20070097154A1Publication Date: 2007-05-03
- Inventor: Toshiya Kojima
- Applicant: Toshiya Kojima
- Assignee: FUJI PHOTO FILM CO., LTD.
- Current Assignee: FUJI PHOTO FILM CO., LTD.
- Priority: JP2005-268560 20050915
- Main IPC: B41J2/01
- IPC: B41J2/01
Abstract:
The wiring board has electrical wires of a prescribed pattern. More specifically, the wiring board has a substrate on which grooves are formed in the prescribed pattern, each of the grooves having an undercut part; and a conductive material which is disposed inside the grooves so as to serve as the electrical wires.
Public/Granted literature
- US07630207B2 Wiring board, method of manufacturing wiring board, and liquid ejection head Public/Granted day:2009-12-08
Information query
IPC分类:
