A method for manufacturing multilayer flexible circuits is disclosed. The cross-sectional area of an unoccupied signal layer volume is initially determined. The unoccupied signal layer includes multiple conductive elements, and the unoccupied signal layer volume is formed between two of the conductive elements. Next, the thickness of an adhesive layer for filling the unoccupied signal layer volume is determined. Finally, the thickness of the adhesive layer is adjusted such that the adhesive layer only fills the unoccupied signal layer volume while the two conductive elements come in direct contact with a dielectric layer without any adhesive in between.