Invention Application
- Patent Title: Substrate structure, substrate manufacturing method and electronic device
- Patent Title (中): 基板结构，基板制造方法及电子元件
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Application No.: US11635224Application Date: 2006-12-07
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Publication No.: US20070149025A1Publication Date: 2007-06-28
- Inventor: Tokihiko Mori , Sadao Makita
- Applicant: Tokihiko Mori , Sadao Makita
- Priority: JP2005-369480 20051222
- Main IPC: H01R13/62
- IPC: H01R13/62
Abstract:
According to one embodiment, there is provided a substrate structure including a printed-wiring board. A micro-contact sheet is soldered to the printed-wiring board, and includes a spiral terminal on a first surface thereof and a pad on a second surface thereof. The pad is electrically connected to the spiral terminal. A holding jig presses the micro-contact sheet against the printed-wiring board such that the second surface of the micro-contact sheet contacts with the printed-wiring board.
Public/Granted literature
- US07320602B2 Substrate structure, substrate manufacturing method and electronic device Public/Granted day:2008-01-22
Information query
