Invention Application
- Patent Title: Resin composite copper foil, printed wiring board, and production processes thereof
- Patent Title (中): 树脂复合铜箔，印刷线路板及其制造方法
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Application No.: US11657529Application Date: 2007-01-25
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Publication No.: US20070172674A1Publication Date: 2007-07-26
- Inventor: Mitsuru Nozaki , Morio Gaku , Yasuo Tanaka , Eiji Nagata , Yasuo Kikuchi , Masashi Yano
- Applicant: Mitsuru Nozaki , Morio Gaku , Yasuo Tanaka , Eiji Nagata , Yasuo Kikuchi , Masashi Yano
- Priority: JP016081/2006 20060125; JP065010/2006 20060310
- Main IPC: B32B15/08
- IPC: B32B15/08
Abstract:
A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.
Public/Granted literature
- US07989081B2 Resin composite copper foil, printed wiring board, and production processes thereof Public/Granted day:2011-08-02
Information query
