Invention Application
- Patent Title: Out-of plane spring structures on a substrate
- Patent Title (中): 基片上的平面外弹簧结构
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Application No.: US11364111Application Date: 2006-02-27
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Publication No.: US20070202310A1Publication Date: 2007-08-30
- Inventor: Christopher Chua , Thomas Hantschel , David Fork , Koenraad Van Schuylenbergh , Yan Yang
- Applicant: Christopher Chua , Thomas Hantschel , David Fork , Koenraad Van Schuylenbergh , Yan Yang
- Assignee: Palo Alto Research Center Incorporated
- Current Assignee: Palo Alto Research Center Incorporated
- Main IPC: B32B7/02
- IPC: B32B7/02
Abstract:
A structure has at least one structure component formed of a first material residing on a substrate, such that the structure is out of a plane of the substrate. A first coating of a second material then coats the structure. A second coating of a non-oxidizing material coats the structure at a thickness less than a thickness of the second material.
Public/Granted literature
- US07713388B2 Out-of-plane spring structures on a substrate Public/Granted day:2010-05-11
Information query
