Invention Application
US20070241444A1 CARRIER BOARD STRUCTURE WITH CHIP EMBEDDED THEREIN AND METHOD FOR FABRICATING THE SAME
审中-公开
具有嵌入式芯片的载体板结构及其制造方法
- Patent Title: CARRIER BOARD STRUCTURE WITH CHIP EMBEDDED THEREIN AND METHOD FOR FABRICATING THE SAME
- Patent Title (中): 具有嵌入式芯片的载体板结构及其制造方法
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Application No.: US11734768Application Date: 2007-04-12
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Publication No.: US20070241444A1Publication Date: 2007-10-18
- Inventor: Shih-Ping HSU , Chung Cheng Lien , Zhao Chong Zeng , Shang Wei Chen
- Applicant: Shih-Ping HSU , Chung Cheng Lien , Zhao Chong Zeng , Shang Wei Chen
- Applicant Address: TW Hsin-chu
- Assignee: PHOENIX PRECISION TECHNOLOGY CORPORATION
- Current Assignee: PHOENIX PRECISION TECHNOLOGY CORPORATION
- Current Assignee Address: TW Hsin-chu
- Priority: TW095112958 20060412
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
A carrier board structure with a semiconductor chip embedded therein and a method for fabricating the same are proposed. A rectangular cavity is formed at a predetermined position of the carrier board, and at least a breach is formed at a corner of the rectangular cavity, wherein the breach is composed of a plurality of drilling holes. Thus, the breach is capable of providing the rectangular cavity with a larger space for receiving a semiconductor chip in the rectangular cavity, when in the process of disposing the semiconductor chip into the rectangular cavity.
Information query
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