Invention Application
- Patent Title: Method Of Manufacturing A Dielectric Component, And Dielectric Components Manufactured By Such A Method
- Patent Title (中): 制造介电元件的方法以及通过这种方法制造的电介质元件
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Application No.: US11685050Application Date: 2007-03-12
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Publication No.: US20070285874A1Publication Date: 2007-12-13
- Inventor: Jeffrey Chereson , Robert Ehrensberger , Michael Boudreaux
- Applicant: Jeffrey Chereson , Robert Ehrensberger , Michael Boudreaux
- Main IPC: H01G4/06
- IPC: H01G4/06 ; C25D5/54
Abstract:
A method of forming a dielectric component, such as a capacitor is disclosed. In such a method, a conductive surface is applied to a dielectric to form a coated dielectric. Then a portion of the conductive surface is removed from the coated dielectric to form at least two electrically isolated conductive areas.
Public/Granted literature
- US07611617B2 Method of manufacturing a dielectric component, and dielectric components manufactured by such a method Public/Granted day:2009-11-03
Information query
