Invention Application
- Patent Title: Microfabricated pressure and shear stress sensors
- Patent Title (中): 微型压力和剪切应力传感器
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Application No.: US11880134Application Date: 2007-07-20
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Publication No.: US20080022778A1Publication Date: 2008-01-31
- Inventor: Chang Liu , Jack Chen , Jonathan Engel
- Applicant: Chang Liu , Jack Chen , Jonathan Engel
- Main IPC: G01L9/04
- IPC: G01L9/04 ; G01N3/24

Abstract:
A microfabricated pressure sensor. The pressure sensor comprises a raised diaphragm disposed on a substrate. The diaphragm is configured to bend in response to an applied pressure difference. A strain gauge of a conductive material is coupled to a surface of the raised diaphragm and to at least one of the substrate and a piece rigidly connected to the substrate.
Public/Granted literature
- US07509869B2 Microfabricated pressure and shear stress sensors Public/Granted day:2009-03-31
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