Invention Application
- Patent Title: Microelectromechanical systems encapsulation process
- Patent Title (中): 微机电系统封装工艺
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Application No.: US11510040Application Date: 2006-08-25
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Publication No.: US20080050845A1Publication Date: 2008-02-28
- Inventor: Markus Ulm , Brian Stark , Matthias Metz , Tino Fuchs , Franz Laermer , Silvia Kronmueller
- Applicant: Markus Ulm , Brian Stark , Matthias Metz , Tino Fuchs , Franz Laermer , Silvia Kronmueller
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.
Public/Granted literature
- US07563633B2 Microelectromechanical systems encapsulation process Public/Granted day:2009-07-21
Information query
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