Invention Application
- Patent Title: Non-Halogen Flame Retardant and Highly Heat Resistant Phosphorous-Modified Epoxy Resin Compositions
- Patent Title (中): 非卤素阻燃和高耐热磷改性环氧树脂组合物
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Application No.: US11886126Application Date: 2006-03-10
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Publication No.: US20080097014A1Publication Date: 2008-04-24
- Inventor: Chong-Soo Park , Choong-Ryul Lim , Jae-Ho Choi , Bong-Goo Choi , Tae-Kyoo Shin , Eun-Yong Lee
- Applicant: Chong-Soo Park , Choong-Ryul Lim , Jae-Ho Choi , Bong-Goo Choi , Tae-Kyoo Shin , Eun-Yong Lee
- Priority: KR10-2005-0020506 20050311
- International Application: PCT/KR06/00863 WO 20060310
- Main IPC: C09K21/12
- IPC: C09K21/12 ; C08K3/40 ; C08K5/1545 ; C08L71/02

Abstract:
Disclosed is a non-halogen type highly heat resistant flame retardant epoxy resin composition that is made by compounding a phosphorous-modified epoxy resin with a phosphazene compound as a flame retardant additive, wherein the phosphorous-modified epoxy resin is obtained by reacting a phosphorous-containing compound with an epoxy resin. The non-halogen flame retardant and highly heat resistant phosphorous-modified epoxy resins according to the present invention have the excellent flame retardancy property and the good thermal property without halogen and thus can be advantageously utilized in manufacturing a printed circuit board (PCB) and for complex materials.
Information query