A method of fabricating a microneedle is disclosed. The method includes forming at least one recess in a substrate, the at least one recess comprising an apex, forming an electrically seed layer on the substrate including the at least one recess, forming at least one electrically nonconductive pattern on a portion of the seed layer, the at least one nonconductive pattern being a pattern for a sensory area, plating an electrically conductive material on the seed layer to create a plated layer with an opening that exposes a portion of the nonconductive pattern and separating the plated layer from the seed layer and the at least one nonconductive pattern to release a hollow microneedle comprising a tip and at least one sensory area.