Methods for electrodeposition of conductive material on a conductive substrate that contains a pattern of a chemisorbed surfactant formed by a stamp having a patterned surface which is pressed onto the surface of the substrate for printing the substrate. Electrodeposition occurs by immersing the patterned substrate in a plating bath upon application of deposition potential or current to the conductive substrate. In embodiment, the chemisorbed surfactant on the surface of the substrate acts as a positive resist so that electrodeposition occurs on regions of the substrate not covered with surfactant. In another embodiment, electrodeposition occurs preferentially in regions of the substrate covered with the chemisorbed surfactant.